? 2017 kingbright. all rights reserved. spec no: dsan2787 / 1101027546 rev no: v.2b date: 05/26/2017 page 1 / 5 descriptions the source color devices are made with ingan light emitting diode electrostatic discharge and power surge could damage the leds it is recommended to use a wrist band or anti-electrostatic glove when handling the leds all devices, equipments an d machineries must be electrically grounded features low power consumption popular t-1 3/4 diameter package general purpose leads reliable and rugged long life - solid state reliability available on tape and reel rohs compliant applications status indicator i lluminator signage applications decorative and entertainment lighting commercial and residential architectural lighting attention observe precautions for handling electrostatic discharge sensitive devices package dimensions selection guide notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. luminous intensity / luminous flux: +/-15%. 3. luminous intensity value is traceable to cie127-2007 standards. part number emitting color (material) lens type iv (mcd) @ 20ma [2] viewing angle [1] min. typ. 2 1/2 WP7113VRVC1C water clear pink (ingan) 1300 2500 20 WP7113VRVC1C t-1 3/4 (5mm) solid state lamp notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3. lead spacing is measured where the leads emerge from the package. 4. the specifications, characteristics and technical dat a described in the datasheet are subject to change without prior notice.
? 2017 kingbright. all rights reserved. spec no: dsan2787 / 1101027546 rev no: v.2b date: 05/26/2017 page 2 / 5 parameter symbol value unit power dissipation p d 120 mw reverse voltage v r 5 v junction temperature t j 115 c operating temperature t op -40 to +85 c storage temperature t stg -40 to +85 c dc forward current i f 30 ma peak forward current i fm [1] 100 ma electrostatic dischar ge threshold (hbm) - 250 v lead solder temperature [2] 260c for 3 seconds lead solder temperature [3] 260c for 5 seconds absolute maximum ratings at t a =25c electrical / optical characteristics at t a =25c notes: 1. measurement tolerance of the chromaticity coordinates is 0.02. 2. forward voltage: 0.1v. 3. excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradat ion or premature failure. WP7113VRVC1C parameter symbol emitting color value unit typ. max. chromaticity coordinates x i f = 20ma x [1] pink 0.35 - - chromaticity coordinates y i f = 20ma y [1] pink 0.15 - - capacitance c pink 100 - pf forward voltage i f = 20ma v f [2] pink 3.3 4.0 v reverse current (v r = 5v) i r pink - 50 ua notes: 1. 1/10 duty cycle, 0.1ms pulse width. 2. 2mm below package base. 3. 5mm below package base. 4. relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static e lectricity ? ref jedec/jesd625-a and jedec/j-std-033.
? 2017 kingbright. all rights reserved. spec no: dsan2787 / 1101027546 rev no: v.2b date: 05/26/2017 page 3 / 5 0.5 0.5 0.0 -90 -75 -60 -45 -30 -15 75 60 45 30 0 15 90 1.0 1.0 t a = 25 c technical data spatial distribution 0 10 20 30 40 50 2.0 2.4 2.8 3.2 3.6 4.0 t a = 25 c forward voltage (v) forward current (ma) 0.0 0.5 1.0 1.5 2.0 2.5 0 1020304050 t a = 25 c forward current (ma) luminous intensity normalised at 20ma 0 10 20 30 40 50 -40-20 0 20406080100 ambient temperature (c) permissible forward current (ma) 0.0 0.5 1.0 1.5 2.0 2.5 -40-200 20406080100 ambient temperature (c) luminous intensity normalised at t a = 25 c pink forward current vs. forward voltage luminous intensity vs. forward current forward current derating curve luminous intensity vs. ambient temperature WP7113VRVC1C recommended wave soldering profile notes: 1. recommend pre-heat temperature of 105c or less (as measured with a thermocouple attached to the led pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260c 2. peak wave soldering temperature between 245c ~ 255cfor 3 sec (5 sec max). 3. do not apply stress to the epoxy resin while the temperature is above 85c. 4. fixtures should not incur stress on the component when mounting and during soldering process. 5. sac 305 solder alloy is recommended. 6. no more than one wave soldering pass. packing & label specifications
? 2017 kingbright. all rights reserved. spec no: dsan2787 / 1101027546 rev no: v.2b date: 05/26/2017 page 4 / 5 WP7113VRVC1C x y x y x y va1 0.4735 0.2451 vc1 0.3629 0.1737 0.2556 0.1044 0.4548 0.2330 0.3448 0.1620 0.2380 0.0931 0.4783 0.2194 0.3713 0.1518 0.2682 0.0867 0.4964 0.2309 0.3888 0.1629 0.2850 0.0973 va2 0.4548 0.2330 vc2 0.3448 0.1620 ve2 0.2380 0.0931 0.4363 0.2211 0.3267 0.1504 0.2205 0.0818 0.4602 0.2080 0.3538 0.1408 0.2514 0.0761 0.4783 0.2194 0.3713 0.1518 0.2682 0.0867 va3 0.4363 0.2211 vc3 0.3267 0.1504 ve3 0.2205 0.0818 0.4178 0.2091 0.3088 0.1388 0.2030 0.0705 0.4422 0.1966 0.3364 0.1298 0.2347 0.0656 0.4602 0.2080 0.3538 0.1408 0.2514 0.0761 vb1 0.4178 0.2091 vd1 0.3088 0.1388 vf1 0.2030 0.0705 0.3994 0.1973 0.2910 0.1273 0.1857 0.0593 0.4243 0.1853 0.3192 0.1189 0.2182 0.0551 0.4422 0.1966 0.3364 0.1298 0.2347 0.0656 vb2 0.3994 0.1973 vd2 0.2910 0.1273 vf2 0.1857 0.0593 0.3811 0.1855 0.2732 0.1158 0.1683 0.0481 0.4065 0.1741 0.3021 0.1081 0.2018 0.0448 0.4243 0.1853 0.3192 0.1189 0.2182 0.0551 vb3 0.3811 0.1855 vd3 0.2732 0.1158 vf3 0.1683 0.0481 0.3629 0.1737 0.2556 0.1044 0.1510 0.0369 0.3888 0.1629 0.2850 0.0973 0.1856 0.0345 0.4065 0.1741 0.3021 0.1081 0.2018 0.0448 ve1 cie chromaticity diagram notes: shipment may contain more than one chromaticity regions. orders for single chromaticity region are generally not accepted. measurement tolerance of the chromaticity coordinates is 0.02. vf ve vd vc vb va 0.0 0.1 0.2 0.3 0.1 0.2 0.3 0.4 0.5 0.6 x y va1 va2 va3 vb1 vb2 vb3 vc1 vc2 vc3 vd1 vd2 vd ve1 ve2 ve3 vf1 vf2 vf3
? 2017 kingbright. all rights reserved. spec no: dsan2787 / 1101027546 rev no: v.2b date: 05/26/2017 page 5 / 5 precautionary notes 1. the information included in this document reflects representative usage scenarios and is intended for technical reference on ly. 2. the part number, type, and specifications mentioned in this document are subject to future change and improvement without no tice. before production usage customer should refer to the latest datasheet for the updated specifications. 3. when using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. if customer usage exceeds the specified limits, kingbright will not be responsible for any subsequent issues. 4. the information in this document applies to typical usage in consumer electronics applications. if customer's application ha s special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with kingbright representative for further assistance. 5. the contents and information of this document may not be reproduced or re-transmitted without permission by kingbright. 6. all design applications should refer to kingbright application notes available at http://www.kingbrightusa.com/applicationnotes precautions storage conditions 1. avoid continued exposure to the condensing moisture environm ent and keep the product away from rapid transitions in ambient temperature. 2. leds should be stored with temperature 30c and relative humidity < 60%. 3. product in the original sealed package is reco mmended to be assembled within 72 hours of opening. product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100c. led mounting method 1. the lead pitch of t he led must match the pitch of the mounting holes on the pcb during component placement. lead-forming may be required to insure the lead pitch matches the hole pitch. refer to the figure below for proper lead forming procedures. note 1-3: do not route pcb trace in the contact area between the leadframe and the pcb to prevent short-circuits. " " correct mounting method " x " incorrect mounting method 2. when soldering wires to the led, each wire joint should be s eparately insulated with heat-shrink tube to prevent short-circu it contact. do not bundle both wires in one heat shrink tube to avoid pi nching the led leads. pinching stress on the led leads may damage t he internal structures and cause failure. 3. use stand-offs (fig.1) or spacers (fig.2) to securely position the led above the pcb. 4. maintain a minimum of 3mm clearance between the base of the led lens and the first lead bend (fig. 3 ,fig. 4) . 5. during lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the led lens and its internal structures. do not perform lead forming once the component has been mounted onto the pcb. (fig. 5 ) lead forming procedures 1. do not bend the leads more than twice. (fig. 6 ) 2. during soldering, component covers and holders should leave clearance to avoid placing damaging stress on the led during soldering. (fig. 7) 3. the tip of the soldering iron should never touch the lens epoxy. 4. through-hole leds are incompatible with reflow soldering. 5. if the led will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat, please check with kingbright for compatibility. WP7113VRVC1C
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